Recovering High-Value PCB Assemblies Through Precision BGA Rework

The Challenge

An industrial electronics manufacturer identified soldering defects around BGA components during final inspection. The affected control boards were high-value assemblies, and replacing the complete batch would have increased costs and delayed customer delivery.

The company needed a partner capable of recovering the boards without damaging nearby components, tracks or pads.

The Solution

Elcoteq inspected the affected boards to determine whether they could be repaired. The team carried out controlled BGA removal, pad cleaning, reballing and component replacement.

Damaged pads and tracks were repaired where required. Each recovered board then underwent detailed inspection and functional testing before being approved for return.

The Outcome

The rework programme helped the customer recover a significant portion of the affected boards. This reduced replacement costs, limited production delays and returned usable assemblies to the manufacturing line.

✓ High-Value Boards Successfully Recovered
✓ Lower Replacement Costs
✓ Reduced Material Waste
✓ Controlled BGA Rework Process
✓ Boards Inspected Before Return
✓ Production Delays Minimized